New methods to advance the state-of-the-art of pressure sensors for the Space Shuttle Main Engine were demonstrated. The results of the feasibility and breadboard demonstration phase and the current status of the research development prototype follow-on phase are presented. A technology breakthrough utilizing silicon piezoresistive technology was achieved in the first phase. A transducer design concept for the SSME application utilizes packaging materials with similar thermal coefficients of expansion and maintains the transducer seals primarily in compression. The silicon chip design will provide dual sensing outputs with laser trimmable integrated compensating electronics. The silicon resistor ion implant dose was customized for the SSME temperature requirement. A basic acoustic modeling software program was developed to evaluate the frequency response characteristics for the package design.